Chemical Compatibility 

Teslin synthetic printing substrate is composed of a very high molecular weight polyolefin phase and a filler phase that is primarily silica. The compatibility of Teslin substrate with solvents and reagents reflects this dual composition.

Inorganic acids generally have little effect on the dimensions and mechanical properties of Teslin substrate even at elevated temperatures (e.g., 122° F).
Certain organic acids can cause swelling of the polymer. Strongly oxidizing acids (e.g., concentrated nitric and fuming sulfuric acids) will attack the polymer phase and lead to embrittlement and loss of properties of Teslin substrate. Hydrofluoric acid will dissolve the silica filler leading to shrinkage of product. A portion of the filler in Teslin HD 1400 and 1800 substrates is acid sensitive; therefore, these grades are not recommended for contact with acids. Aqueous solutions of acidic or neutral salts generally do not affect the dimensions or physical properties of Teslin substrate.
Bases with a pH level of less than approximately 8.5 have little effect on the dimensions of Teslin substrate. Alkali bases (e.g., sodium or potassium hydroxide) at higher pH levels or elevated temperatures will attack the silica filler and lead to shrinkage as the silica is removed from the sheet. Elevated temperatures may also lead to dimensional changes with weaker bases.

Polar solvents, e.g., alcohols and esters, typically have little to no effect on the dimensions or physical properties of Teslin substrate. Some discoloration has been noted when highly colored impurities in such solvents are absorbed on the silica in Teslin substrate. Chlorinated organic and aromatic solvents -- generally the most aggressive organic solvents -- cause swelling of Teslin substrate and some loss of tensile properties.

Results of chemical exposure testing are reported below. PPG Industries presents this data for guidance in the use of Teslin substrate. Samples should be tested under actual or simulated use conditions to confirm the stability of Teslin substrate in the proposed environment.

Chemical Resistance of Teslin SP 1000 substrate at 70 ° F

Chemical Conc.
Contact Time
Strength Effect on
Nitric Acid 10 100 None None ---
Nitric Acid 70 10 Some Some ---
Phosphoric Acid 10 10 None None ---
Hydrochloric Acid 37 1000 None Slight ---
Sulfuric Acid 10 1000 None None ---
Sulfuric Acid 96 1000 None Slight ---
Ammonium Hydroxide 28 1000 None None Shrinkage
Sodium Hydroxide 40 1000 Some None Shrinkage
Methyl Ethyl Ketone 100 1000 None None ---
Toluene 100 1000 None None Slight Swelling
Glycerol 100 1000 Some None Swelling
Ethyl Acetate 100 1000 None None ---
Tetrahydrofuran 100 1000 None None ---
Xylene 100 1000 None None ---

24-Hour Solvent Resistance of Teslin SP 1000 substrate at 70 ° F

Effect On
Length Thickness
Preferred Solvents
Methanol None None
2-Propanol None None
n-Butyl Alcohol None None
n-Propanol None None
Acetone None None
Ethyl Acetate None None
Methyl Ethyl Ketone (2-Butanone) None None
Hexane None None
Petroleum Ether None None
Tetrahydrofuran None None

Use Sparingly
n-Hexyl Alcohol None Slight
Methylene Chloride None Slight
Mineral Spirits Slight None
Toluene Slight None
Xylene Slight None
Kerosene Slight None

Avoid If Possible
Glycerol Some None
Isobutyl Acetate None Some