PPG introduces new FAST CS7 CMP polishing pads at SEMICON West 2005 SAN FRANCISCO, July 12, 2005
– PPG Industries today introduced its family of FAST CS7 polishing pads for the chemical mechanical planarization (CMP) market, to complement its line of Fast S7 pads, at SEMICON West 2005.
New FAST CS7 pads feature discrete, separate closed-cell pores that present slurry uniformly on the pad surface. FAST S7 open-cell pads have pores distributed continuously throughout the pad matrix for rapid and efficient distribution of slurry across and through the pad surface. A facility opened north of Pittsburgh earlier this year to support PPG's increased pad production.
Both pad series are based on proprietary PPG thermoset polyurethane resins that provide polish uniformity, planarization efficiency, high throughput, long pad life and low-defect wafer finishing in CMP applications. Also, both lines of pads are surfaced and grooved on computer-controlled equipment then finished and packaged in a cleanroom environment for within-pad and pad-to-pad consistency.
CMP engineers can select from an array of FAST pads suited to particular processes and toolsets and designed to accommodate increasingly complex planarization requirements. FAST pads range from 10 inches to 30 inches in diameter and are available for most 200-mm and 300-mm CMP tools and applications including oxide, tungsten, copper and barrier polishing.
Pittsburgh-based PPG is a global supplier of coatings, glass, fiber glass and chemicals, with 108 manufacturing facilities and equity affiliates in more than 20 countries. Sales were $9.5 billion
FAST is a registered trademark of PPG Industries, Inc.